Flashback to IMP days conference
Last April, we were honored to have you in Lyon for the 2nd IMP Days conference, focusing on thermosetting polymers, their synthesis, applications, processing, recycling, environmental impact, and also about their composites.
More than 130 scientists were gathered, and we wanted to thank you all for coming, and for the quality of the contributions. Nearly 30 oral communications, 13 keynotes and 20 posters were presented. We hope that you enjoyed either the scientific content or also the social event. The invited speakers were:
- Miroslava DUSKOVA, Institute of Macromolecular Chemistry, Prague, Czech Republic
- Cristina ELIZETXEA, Tecnalia Research Center, San Sebastian, Spain
- Alaitz RUIZ DE LUZURIAGA, CIDETEC, San Sebastian, Spain
- Raquel VERDEJO, Institute of Polymer Science and Technology, Madrid, Spain
- Baris DEMIR, University of Queensland, Bisbane, Australia
- Ludovic DUMAS, Huntsman, Switzerland
- Andrew MILLS, Cranfield University, United Kingdom
- Francesco QUATRARO, University of Torino, Italy
- Andrzej RYBAK, ABB Corporate Research Center, Krakow, Poland
- Markus STOMMEL, Leibniz Institute for Polymer Research, Dresden, Germany
- Luigi TORRE, University of Perugia, Italy
- Stéphane VILLALONGA, CEA, Le Ripault, France
We also thank the sponsors for their financial support: Syensqo, Michelin and Institut Carnot Ingénierie@Lyon.
Some pictures from our event:
We hope to welcome you again for the next IMP days conference, in 2026.
If you enjoyed our event in Lyon, IMP laboratory will also be honored to welcome to the next Polycondensation international conference, held in September (https://polycond-2024.sciencesconf.org/) or to the next Polymer Blends and Eurofillers joint conference in Jan. 2025 (https://pb-eurofill2025.sciencesconf.org/) , or to the Annual European Rheology Conference, of the European Society of Rheology in April 2025 (https://rheology-esr.org/aerc-2025/welcome/). Stay tuned by following IMP Laboratory on social networks (LinkedIn, X) and on our website.